The OPE journal Newsletter for September 2017 
OPE journal
BenQ Materials Showcases Diversified Functional Film Applications at Touch Taiwan 2017
 
The Taiwanese company BenQ Materials exhibits at Touch Taiwan 2017 and showcases a full line of functional film solutions for different applications, including high durability display for outdoor applications, AMOLED solutions for wearable applications, advanced precision machining products for specific target markets and smart optical films for interior decorating applications.
 
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LG and Samsung invest €25 million in CYNORA
 
CYNORA (Bruchsal, Germany), a leading provider of highly efficient organic emitter materials for OLEDs, announced that the two Korean tech giants have decided to support CYNORA on its way to becoming a major player for OLED emitting materials.
 
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Merck debuts automotive innovations at the IAA
 
Merck, a leading science and technology company based in Darmstadt, Germany, exhibits for the first time at the International Motor Show (IAA) in Frankfurt, Germany, presenting its innovative solutions for the automotive industry that are reported to enhance functionality and aesthetics in automotive engineering.
 
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CPEIA rebrands as intelliFLEX Innovation Alliance, takes over STWIA
 
The intelliFLEX Innovation Alliance is the new name and new brand identity of the Canadian Printable Electronics Industry Association (CPEIA).
 
At the 2016 AGM in May, members granted the CPEIA and the board of the directors licence to expand the technology scope and membership of the association to include flexible, hybrid and wearable electronics, as well as rebrand the association. The new name reflects the diverse but interconnected nature of the technology and applications for printable, flexible, wearable and hybrid electronics.
 
 
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Frost & Sullivan names TactoTek winner of 2017 Global Technology Innovation Award
 
The global consulting firm Frost & Sullivan announced that TactoTek from Oulu, Finland, has received its 2017 Best Practices Award for 3D injection moulded structural electronics technology innovation.
 
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LOPEC 2018 and drinktec 2017: Intelligent packaging for the beverage industry
 
The global market for intelligent packaging with printed electronic components is growing rapidly. Messe München is focusing on this topic with two events: drinktec, the world’s leading trade fair for the beverage and liquid food industry, will take place from 11 to 15 September 2017. The drinktec Forum on 14 September will provide information about printed electronics applications in the beverage industry. LOPEC, the international exhibition and conference for the printed electronics industry, will then take place six months later from 13 to 15 March 2018 and will focus, among other things, on smart packaging.
 
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